Senior Design Engineer, Microelectronics and Advanced Packaging
- Employment type
- Full-time · On-site
- Posted
- November 13, 2026
- Province
- Ontario (ON)
Hiring confidence: Sparse posting · 22/100
This posting is missing most of the signals we look for, or shows patterns common to listings that are not actively being filled. Check with the employer before applying. How this is scored
Job Overview
This role is based in Ontario. Sanmina is hiring for this full-time position through Jobily, where you can check how well your resume matches the posting before you apply.
Market context
About this role in Ontario
Average salary for Senior Design Engineer, Microelectronics and Advanced Packaging in Ontario
We do not have a salary benchmark for this title in Ontario yet. The posting does not state a salary either.
NOC code
This posting has not been matched to a NOC 2021 unit group yet. Use the NOC finder to identify the code from the duties listed above.
Typical qualifications for Canadian employers
- Advanced degree in electrical engineering, materials science, or related field (or equivalent experience)
- Extensive experience in microelectronics and advanced packaging design
- Strong knowledge of RF, microelectronic, and optical component design
- Experience with prototype development and testing
- Familiarity with process development and manufacturing
Fit check
Is this role right for you?
Top skills this posting asks for:
- Microelectronics design
- Advanced packaging
- RF component design
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What you'll do
- Design RF, microelectronic, and optical components
- Develop integrated subsystems
- Support design concept through prototype design and testing
- Participate in process development initiatives
- Contribute to assembly and test innovation
- Support transition to volume manufacturing
- Partner with customers to enable product development
- Provide technical guidance and mentorship
What you'll need
- Advanced degree in electrical engineering, materials science, or related field (or equivalent experience)
- Extensive experience in microelectronics and advanced packaging design
- Strong knowledge of RF, microelectronic, and optical component design
- Experience with prototype development and testing
- Familiarity with process development and manufacturing
- Technical expertise in assembly and test innovation